晶圆是什么意思_晶圆用英语怎么说_晶圆的翻译_晶圆翻译成_晶圆的中文意思_晶圆怎么读,晶圆的读音,晶圆的用法,晶圆的例句

Hot plate with silicon wafer in initial configuration ( before heating ).

加热板与矽晶圆在启始状态 ( 加热前 ).

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Bonding Interface - The area where the bonding of two wafers occurs.

绑定面 - 两个晶圆片结合的接触区.

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Investment decisions have to be made long before products can be sold.

芯片农夫不得不花数十亿美元并等待数年直到能开始在晶圆片上雕刻电路.

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Primary Orientation Flat - The longest flat found on the wafer.

主定位边 - 晶圆片上最长的定位边.

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Also, the PL spectral peak vary over the wafer.

而且, 激发萤光光谱的峰值会随著探测晶圆不同处而变化.

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Smudge - A defect or contamination found on the wafer caused by fingerprints.

划伤 - 晶圆片表面上的小皱造成的缺陷.

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Pit - A non - removable imperfection found on the surface of a wafer.

深坑 - 一种晶圆片表面无法消除的缺陷.

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Waviness - Widely spaced imperfections on the surface of a wafer.

波纹 - 晶圆片表面经常出现的缺陷.

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Wafer, Powder Drink, Chocolate Cream, Cologne, Hot and Cold Drinkings Food Products.

采购产品晶圆, 粉末饮料, 巧克力,奶油, 科隆, 热和冷的食物产品.

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Lay - The main direction of surface texture on a wafer.

层 - 晶圆片表面结构的主要方向.

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Hot plate with silicon wafer lowered to heating position.

加热板与矽晶圆降低至加热位置.

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Required - The minimum specifications needed by the customer when ordering wafers.

必需 - 订购晶圆片时客户必须达到的最小规格.

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Scratch - A mark that is found on the wafer surface.

擦伤 - 晶圆片表面的痕迹.

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Contamination Particulate - Particles found on the surface of a silicon wafer.

沾污颗粒 - 晶圆片表面上的颗粒.

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Once cut, the wafers are polished until they have flawless, mirror - smooth surfaces.

切割出的晶圆经过抛光,表面变得毫无瑕疵 、 如同镜子.

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