翻译
焊盘
- [hàn pán]
释义
- pad 给…装衬垫, 加垫子; 填塞; 踏平;
实用场景例句
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Using a manual or pneumatic dispensing device, apply the solder paste to the pads.
使用手动或气动刷锡设备把锡膏刷到焊盘上.
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To achieve the required bump heights, the solder paste is over - printed onto the wafer bond pads.
为了获得要求的凸起高度, 锡膏在晶片焊盘过焊.
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The designing of bonding pads is the key in surface mount technology ( SMT ).
焊盘设计技术是表面组装技术 ( SMT ) 的关键.
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Solder Bumps: Round solder balls bonded to the pads of components used in face - down bonding techniques.
焊锡突点: 在晶面向下的黏结技术中用于黏接元件焊盘的圆形焊料球.
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Pitch: The center - to - center spacing between conductors, such as pads and pins, on a PCB.
间距: PCB上导体, 比如焊盘和插脚之间中心到中心的距离.
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bonding pad
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