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翻译
  • CMP

    释义

    • abbr.
      Command Module Pilot 指挥舱驾驶员; Computed Maximum Pressure 计算的最大压力; Corrugated Metal Pipe 波纹金属管

    大小写变形:cmp

  • 实用场景例句

    • 全部

    The CMP process is also used to control film thickness and removal of barrier layers.

    CMP技术也用于控制薄膜厚度及剥离隔离层.

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    Mathematical models were developed to simulate particle reduction in CMP slurry distribution systems.

    为模拟cmp磨料 分配系统的粒子减少开发了数字模型.

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    Recent investigation shows that CeC & gt ; 2 nanoparticles can be used as CMP slurry to polish IC chip.

    最新研究表明,纳米 CeO _2可用于集成电路芯片加工的化学机械抛光(CMP)浆料.

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    Then its CMP properties on hard disk substrate with nickel - phosphorous plated was studied.

    进而研究了其在镍磷敷镀的硬盘基片CMP中 的抛光特性.

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    The presented parallel algorithms can be referred in designing CMP system and optimizing other applications.

    这些算法的提出,为今后CMP系统的设计以及其他应用在CMP体系结构上的并行优化提供了参考.

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    Under the optimal conditions, about 45.7 % CMP was transformed to CTP.

    在最优化条件下, 转化率达45.7%.

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    After the 2.2.15 cell line was planted 24 hours, CMP and Alcilovir ( ACV ) were added.

    将2.2.15细胞株种板24h后, 分别加入羧甲基茯苓多糖和阳性对照药阿昔洛韦 ( ACV ) .

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    The major problem in Cu CMP is dishing, serious dishing will cause the yield loss.

    铜化学机械抛光是近些年发展最快的一种工艺,铜碟形是铜化学机械抛光工艺中的主要问题之一.

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    The rates of sensitivity to aminopenicillin ( AMP ) , chloramphenicol ( CMP ) , kanamycin ( KM ) , complex sulfamethoxazole - trimethoprim ( COS ) , gentamicin ( GN ) , neomycin ( NM ), tobramycin ( TOB ) , amikacin ( AKN ) and norfloxacin ( NOR ) were high, between 84.4 % and 95.5 %.

    对链霉素、痢特灵 、 羧 苄青霉素及 四环素 的耐药率较高, 在129%~457%之间, 对红霉素的耐药率高达949%.

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    The Chemical mechanical polishing technique in the field of semiconductor industry was introduced.

    介绍了半导体工业中蓬勃发展的化学机械抛光(CMP)技术.

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    收起实用场景例句
  • 行业词典

    • 医学

      cytidine monophosphate一磷酸胞苷